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英语单词知识竞赛

201zigzag inline package（ZIP）
202stub
203green sheet
204magnetic head
205flux residue
206shrink quad flat package（SQFP）
207composite part
208warp -wise
209heat resistance
210capillary
211photoetching
212noncircular
213acceptance tests
214alminum
215heat sink
216thick film thermo-sensitive device
217functional film
218open
219water vapor transmission rate
220resolution
221Identical processing
222stand off
223Embedded capacitanceA（capacitor）
224Fatigue limit
225wafer
226Roughening
227Coefficient of Thermal
228creep *
229industrial water law
230cure percent
231ionizable contaminant
232Flush-press metal conductor
233graphics display
234flip chip bonding（FCB）
235electrophoresis
236unsaturated polyester
237strand
238metal quad flat package（MQFP）
239bridging
240anti reflection film
241polyester woven glass fabric copper - clad laminates
242effluent
243bonding layer
244flux activity
245component
246adhesion strength
247chalcogenide semiconductor
248Comparative Tracking Index
249thermal shock test
250vesication
251mealing
252Quality control level
253stray current
254thick film thermistor
255tape automated bonding（TAB）
256small outline integrated circuit（SOIC）
257press platen
258small outline l-leaded package（SOI）
259Etchback
260Activating
261degassing
262passivation
263pumice powder
264Photoimageable Dielectric
265adsorption
266magneto-fluid ink
267original production master
268solvent resistance
269packaging and interconnecting assembly
270underplate
271chip-on-glass（COG）
272interfacial connection
273thixotropy
274covering power
275fibre exposure
276first article
277pull - off strength
278mass lamination panel
279from-to list
280wicking phenomenon
281camera work
282cut to size panel
283chip on board
284Contact finger
285cut-off
286prototype
287toluene
288bevelling
289in cineration
290orange peel
291radiometer
292crosslink
293Ultraviolet
294balanced transmission line
295Outer Layer
296electrodeposited copper foil（ED copper foil）
297land spacing
298deposition rate
299Flane Retardant（or Flame Resistant）
300plated through-hole method on the punched hole
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