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25002polyester woven glass fabric copper - clad laminates

25003anti reflection film

25005metal quad flat package（MQFP）

25007unsaturated polyester

25008electrophoresis

25009flip chip bonding（FCB）

25010graphics display

25011Flush-press metal conductor

25012ionizable contaminant

25013cure percent

25014industrial water law

25016Coefficient of Thermal

25017Roughening

25018wafer

25019Fatigue limit

25020Embedded capacitanceA（capacitor）

25022Identical processing

25023resolution

25024water vapor transmission rate

25025open

25026functional film

25027thick film thermo-sensitive device

25030acceptance tests

25031noncircular

25032photoetching

25034heat resistance

25035warp -wise

25036composite part

25037shrink quad flat package（SQFP）

25038flux residue

25039magnetic head

25040green sheet

25041stub

25042zigzag inline package（ZIP）

25045tensile modules of elasticity

250463（Three）Dimensional package

25047lifted land

25049co - firing

25050solder connection pinhole

25051functional test

25053off - contact printing

25054simulated aging

25057shank

25058processability

25059steel rule die

25060cable

25061image transfer

25062solder ball

25063Sequential build-up

25065polyarmide fiber

25067phototropic

25068primary side

25070reed

25073dicyandiamide

25074cadmium plating

25075heat sink plane

25076superimposed current electroplating

25077lattice defect

25078polymerize

25079Metal-clad base material

25080Flat

25081roller coating

25082just-time（JIT）

25083single - image production master

25084flare

25085major defect

25087wet lamination

25089Nonionic contaminant

25090body land clearance

25091failure digit（FIT）

25092aqueous flux

25093roughness of hole wall

25094rosin

25095gold paste

25096catalyst, catalyzer（同义词）

25097firing sensitivity

25098dielectric dissipation factor

25099incoming degree

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