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25101fillet （adhesive）

25102compound semiconductor

25103radio frequency-sputtering

25105ply

25106thermal zone

25107automated component insertion

25108metal core base material

25109crack of plating

25110glazed subtrate

25111Insulated metal substrate

25112throwing power

25113condensation soldering

25114viscosimeter

25115photoswitch

25117Composite Epoxy Material

25118photocationic polymerization

25119minimum electrical spacing

25120transmittance

25121multilayer ceramic substrate

25122chip capacitor

25124manhattan path

25125laser via hole

25126Interconnection stress

25127porosity（solder）

25128Acceleration

25129chelating agent

25130die bonding

25131hole conditioning

25132pattern plating

25134concentration polarization

25135ion beam evaporation

25136assembly aided architectural design（AAAD）

25137Direct Immersion Gold

25138static electrode potential

25139flush conductor

25141bow

25144silicone gel

25146cure

25147reclaiming

25148chemical passivation

25149sampling inspection

25151amorphous polymer

25152terminal clearomee hole

25153axis

25154stencil printing

25156logic simulation

25157Machinability

25158package lid

25160film on frame（FOF）

25161plating resist

25162hot melting

25163direct emulsion

25165numerical control（NC）（machine）

25167Bendability

25168Ion Exchange

25169strick feeder

25170treater dirt（base materials）

25171Rigid industrial laminate

25172photo plotting

25173weave texture

25174maximum material condition（MMC）

25176Singlelayer

25177cap lamination

25178corner crack

25179Laser imaging system

25180etched printed board

25182thermal cure

25183general placement equipment

25184bias

25185Printed Waveguide Board

25186simultaneous placement

25187dent

25188hole density

25190high speed electrodeposition

25192Electroless deposition

25194interstitial hole

25195photographic reduction dimension

25196phase

25197thermal relief

25198bond

25199ultraviolet cure

25200edge definition

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